MPCS PROCESS CAPABILITIES

Shop Tolerance:	Standard
Minimum Outer Line Width	.003"
Minimum Inner Line Width	.003"
Minimum Outer Space, Trace/Trace	.003"
Minimum Inner Space, Trace/Trace	.003"
Minimum Outer Space, Trace/Pad	.003"
Minimum Inner Space, Trace/Pad	.003"
Minimum Space, PCB Edge to Conductor	.008"
Layer-to-Layer Registration	+/- .003"
Maximum Finished PCB Thickness	.250"
Minimum Board Thickness Tolerance	+/- 5%
Dimensions – Hole Location	+/- .003"
Dimensions – Fab O. D.	+/- .004"
Fabrication Radius	+/- 5 deg.
Warpage (inch per inch) (flatness of finished board)	.005"
Minimum Component Pitch	.008"
Minimum Dielectric Thickness	.003"
Maximum Number of Layers	24

Pad to Hole Size:	Standard
Minimum Plated Hole Size	.006"
Tolerance – Plated Hole Size	+/- .002"
Nominal Finished Hole Size	.006"
Plane Relief Diameter over drilled hole	.008"
Minimum Outer Non-Plated Hole to Trace Spacing	.008"
Minimum Inner Non-Plated Hole to Trace Spacing	.008"

Drilling:	Standard
Minimum Drill Size	.006"
Maximum Drill Hole Size (above 0.257 is routed)	.257"
Maximum Aspect Ratio	14:1

Testing Capabilities:	Standard
Minimum Component Pitch	.006"
Type of Test Equipment	Flying Probe & Double Sided Tester

Soldermask Criteria:	Standard
SMT Minimum Pad Clearance	.003"
Minimum Soldermask Dam	.003"

Materials Available:	Tg (degrees C)	DK
FR4-04; Standard Multifunctional	150	4.25 – 4.60
FR4-06; High Performance Epoxy Laminate	170	4.29 – 4.60
FR4-08; High Performance, High Speed, High Tg	180	3.7 – 3.8
GETEK	175 – 185	3.8 – 4.2
Polyimide	230 – 260	4.2 – 4.6
BT Epoxy	185	3.6 – 4.1
Thermagon	105	4.1 – 4.3
Teflon, Rogers, Arlon ; High Frequency Laminate	Call for latest specs.	Call for latest specs.

Surface Finishes Available:	Standard
HASL Minimum Thickness	.0003
Immersion Gold Minimum Thickness	2 u in.
Immersion Gold Co-plan	+/-1 u in.
Entek Organic Coating	Co-Planarity = To Cu. Plate
Electroless Nickel	150 u in - .250 u in.

Electrical Characteristics:	Standard
Impedance Tolerance Note: Minimum Tolerance +/- 5 ohms	+/- 8%