Capabilities and Qualifications

Printed Circuit Board Types
Single Sided Boards
Double Sided Boards
Multilayers up to 32 Layers
Flex
Rigid Flex
Through Hole and Surface Mount
SMD Pitch Size to .008
BGA and µBGA Technology
Lead Free
Controlled Impedance
Buried Vias
Blind Vias
Metal Core Boards
Heat Sink Boards

Qualifications
MIL-PRF-55110 Qualification FR4

MIL-PRF-55110 Qualification Polyimide
MIL-P-50884 Qualification
MIL-I-45208 Inspection System
IPC-1710 A
UL 94 V-0
Certified Vendor Participant
Kan-Ban Program
ISO9001:2000
MPCS Brochure


In House Highlights
Completely Automated CAM Stations
In House Photoplotting
Glass Frame Tooling
Flying Probe Net List Testing
Clam Shell Testing
Automatic Optical Inspection with CAM Interface
LPI Soldermask
Dry Film Soldermask
Ionic Contamination Testing
Micro-Sectioning Lab
Complete Chemistry Lab
Atomic Absorption Photo Spectrometry


Surface Finishes
HASL (Hot Air Leveling)
Immersion Nickel / Gold
Deep Nickel Gold
Gold Tip Plating
OSP
Silver
White Tin
Carbon / Conductive Inks
Copper Plating Ceramic Substrates


Production Capabilities
24 Hour Prototypes
Time Critical Production
Production Leadtime 3 Weeks Standard
Stategic Partnerships for Design & Assembly
28,000 square foot facility
Stocking Programs
IPC Class 3 Standard